Speed continues to be a focus for most people in the PC industry. Along with speed customers want smaller packaging. Mechanical cases/packages for laptops, PDA's, etc. continue to shrink in size and with this a major issue becomes heat.

Manufacturers are finding that as speed increases and package sizes decrease, the amount of heat being built up within the enclosure is causing problems for the memory used in the devices.

Vdd can vary from 1.35v to 1.6v for DDR3 and 1.65v to 2.0v for DDR2. When voltage swings are combined with heat, memory failures can occur in laptops and other smaller packaged devices. Testing for potential issues related to voltage swings and heat can finally be accomplished at a very affordable price.

Triad Spectrum is proud to introduce its Heat Chamber/VBUMP kit to assist OEM's, resellers, and integrators in detecting potential memory issues on motherboards resulting from heat and voltage swings. The kit includes both a heat chamber and a Vdd swing simulator.