Enhanced Bus Speed


Testing DDR3 memory at enhanced bus speed is something that test engineers would like to see in their memory test system. Triad Spectrum, Inc. is proud to announce their new TCII-1200 memory test system that tests DDR3 memory at enhanced bus speed up to 1066Mhz. The new TCII-1200 will be upgradeable and allow true bus speed testing at 1.6G in the future.

The TCII-1200 can be used as both a production tool as well as an engineering tool. With over 35 standard industry test patterns available for use in your testing process, there is no problem selecting the right patterns for your particular needs. In addition to the DC testing, the TCII-1200 also supports AC testing. The AC testing feature will allow the end user to program test patterns using the script coding method.

In a production environment thru put is the key. The TCII-1200 comes with dual test sockets to assist you in this process. If you determine you need more test capability you can upgrade the dual sockets to 4 or 8 sockets in parallel.

To further enhance the TCII-1200 as an engineering tool, Schmoo plotting is an option that is available for design engineers to use when introducing new modules before they go to production. There is also engineering characterization for the DC/AC parameters. Error logging on Row/Column/BA and DQ’s is also available.

As your memory business grows and the demand for higher thru put increases, Triad Spectrum, Inc. offers a very good trade-in allowance when you move up to the multi-site TCIII-1200 test solution.

When you look at all of the features and benefits of the new TCII-1200, and then compare the price to other machines in the markets we serve, it is an easy decision for test and production engineers to make. Triad Spectrum, Inc. offers a high performance DDR3 test solution at a very reasonable cost. When this is combined with free software upgrades and superior after sales support, it is easy to see why the TCII-1200 from Triad Spectrum, Inc. is the most talked about test solution in today’s memory business.

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Combination of Failures


1. Functional Failure: Cell stuck-at, coupling, neighborhood sensitivity & software error faults.

2. User Script coding lets the user to program proprietary patterns.

3. Parametric Failure: (AC) Speed timing vs. Vdd threshold, (DC) Leakage and Icc's.

4. Hot Temperature Failure: System high temperature environment.